Electroplated Ceramics, kahi hana hana electroplating seramika, me kahi kino seramika, i hōʻike ʻia i loko o kahi ʻāpana glaze i hoʻopaʻa ʻia ma ka ʻaoʻao o waho o ke kino seramika, ua uhi ʻia kahi papa o ka glue ma ka ʻili kūloko o ka papa glaze, kahi papa. ʻO ka papa one aniani i hoʻopaʻa ʻia ma luna o ka ʻili o ka ʻili, ua hoʻopili ʻia kahi ʻāpana metala ma ka ʻili āpau o waho o ka hana lima, a ua hāʻawi ʻia kahi ʻāpana puaʻa ma ka ʻili o ka ʻili metala; I mea e hōʻike ai i ka hopena o ka helehelena, hiki ke hoʻolālā ʻia ke kino ceramic e like me ka protrusion ʻāpana a i ʻole concave e like me ke ʻano i makemake ʻia, a ua hoʻolei ʻia ka ʻāpana glue a me ke one aniani ma ka ʻaoʻao o waho o ka non-protruding a i ʻole. ʻāpana concave. He mea maʻalahi ka hoʻolālā ʻana o ke kumu hoʻohālike a he manaʻo ikaika ʻekolu-dimensionality, kahi e hoʻonui nui ai i ka nani o nā mea hana seramika.
ʻO ke kaʻina hana electroplating seramika i hana maoli ʻia i nā seramika uila e like me ke kumu kumu, hiki ke hana ʻia i nā ʻano like ʻole. ʻO nā hiʻohiʻona o ke kūpaʻa wela kiʻekiʻe a me ka hana insulation uila kiʻekiʻe o nā ceramics ka mea kaulana loa, a ʻo nā mea maikaʻi o ka haʻahaʻa dielectric mau a me ka dielectric nalowale, nui thermal conductivity, maikaʻi kemika kūpaʻa, a me ka like thermal expansion coefficient o ka mea nui loa.
Hana ʻia nā ʻōnaʻi kaapuni laina ʻoi loa ma luna o nā substrate seramika e ka magnetron sputtering, patterned lithography, etching wet wet, a me ka hana mānoanoa electroplating. Ma ke kaʻina hana kiʻiʻoniʻoni lahilahi, ma muli o ke kaʻina kaʻapuni ʻoniʻoni ʻoniʻoni, ua hoʻoheheʻe ʻia ka ʻili o ka ceramic e ka magnetron sputtering, a ʻoi aku ka mānoanoa o ka ʻāpana keleawe a me ke gula ma mua o 10 microns a i ʻole ma ka electroplating.
